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Radiation Hardened Electronics Market Analysis- Industry Size, Share, Research Report, Insights, Covid-19 Impact, Statistics, Trends, Growth and Forecast 2022-2030

Published Date: July, 2022
No of Pages: 174
Delivery Format: PDF + Excel

$2,950.00

Description of the Report

The Radiation Hardened Electronics Market is projected to increase by a factor of 1.4 billion $ 1.4 billion by 2020 and reach approximately USD 1.7 billion by 2026 at an average CAGR of 3.5 percent during the forecast time.

Industries utilize radiation-hardened electronics to shield systems and devices from radiation-induced damage. The increasing demand for intelligence, surveillance, and reconnaissance (ISR) operations, the high demand for rad-hard electronics in satellite communications, and the growing need for electronic systems capable of enduring significant radioactivity in the nuclear power sector have contributed to the rapid growth of the market. However, challenges in developing natural testing environments and the expensive development costs and design could limit the growth.

COVID-19 Impact on the Radiation Hardened Electronics Market

The COVID-19 crisis has caused worldwide health issues and economic crises. Demand for radiation-hardened electronic devices was growing steadily before the COVID-19 timeframe. Due to the tensions between China and America and the immediate effect of COVID-19 could be seen in the imports of radiation-hardened electronic components within the US. The US, along with Europe, are the leading suppliers of semiconductor parts. The high import tariffs for radiation-hardened electronic components from these countries and disruptions to the supply chain of their components are adversely impacting manufacturers of electronics with a hardened radiation source within both the US and Europe. This could lead to an imbalance in demand and supply, which could harm the expansion of the industry. But, the market is predicted to recover slowly in the coming 2 years and is projected to expand at a CAGR of 3.5 percent from 2020 until 2026.

Drivers: Increasing intelligence surveillance and recon (ISR) global operations

Intelligence, surveillance, and recon (ISR) actions are growing daily within the field of defense to stay in front of adversaries and allies. Every ISR operation will succeed if high-quality, durable, and eco-friendly end-products are utilized. Therefore, the most recent processors, controllers, and electronic equipment are ideal for maritime, space, and military applications in ISR operations. For space operations, electronic equipment has to withstand extreme environments for about 15 years without any loss in performance or power. Electronic components that are radiation-hardened can meet the demands of ISR operations, both in military and commercial applications.

Limitations: Costs of designing and developing

There are some questions about the high cost of radiation-hardened electronics. Because of their lower sales and production volumes and lengthy development cycles have remained expensive all through, which has slowed the competition between major players in the world market for radiation-hardened electronic components. Due to these causes affecting the market, there have been very few innovations created in the last few years, particularly in the field of power devices. Therefore, this could soon slow the market for radiation-hardened electronic devices.

Opportunity: Increasing use of commercial-off-the-shelf products in satellites and other space applications

The importance of commercial off-the-shelf (COTS) components in space satellites and other applications is crucial since the demand for cheap nanosatellites is increasing. COTS parts can be utilized to build small satellites which are mission-specific. For instance, example, the US military has launched plans for smaller satellites to reduce the cost of launch, and the time it takes between deciding to launch a satellite to accomplish a specific mission and finally getting that satellite placed in orbit. COTS parts are also attractive because they provide the highest bandwidth and performance. Demand for high bandwidth in satellite applications has forced designers to select radiation-hardened electronic components.

The challenge: Customized needs of premium customers

The main challenge facing the producers of radiation-hardened electronics and semiconductor systems is the particular requirements of the high-end consumer. This is mainly due to the fact that the military and space missions are highly confidential and application-oriented, due to which there is a vast difference between the requirements of one consumer from another. The businesses strive to meet these requirements as much time, money, and R&D are required during development. Companies also need to modify their design method to meet each requirement of the final customer, for example, the design of radiation hardening and the method. This results in lengthy time-to-market cycles for components that are radiation hardened.

Power Management, by component type, held the most significant part of the Radiation-Hardened Electronics Market.

The power management market has been one of the major segments for radiation-hardened electronic components. The growing power management sector is caused by the rising demand for MOSFETs and diodes for top-of-the-line applications for the defense and space industries. The power management components, such as power switches and metal-oxide-semiconductor field-effect transistors (MOSFETs), accounted for a significant share of ~40% of the global radiation-hardened electronics market in 2019. Power MOSFETs are utilized for high-reliability applications and are specially designed for requirements in space. They have a high degree of durability, Ionizing radiation, and high-energy charged particles. Due to the current COVID-19 disease that is affecting the power management segment has been somewhat affected. Still, it is expected to expand faster over the forecast time alongside other components.

RHBD, by the manufacturing technique type will expand at a faster rate during the forecast time

Radiation hardening by design (RHBD) manufacturing method is predicted to expand at the fastest rate in the electronics market that is radiation-hardened due to the low price per chip, high volume production, and ease of modification. The RHBD microcontrollers, memories, and ASICs are primarily utilized in the space and defense industries and the nuclear power industry. The demand for RHBD designs will be boosted during COVID-19 since RHBD permits easy modification through various government programs based on their intended applications. Although radiation hardening through the procedure (RHBP) is a viable process for producing electronic systems that are radiation-hardened, its acceptance rate for microelectronics producers is lower mainly due to the lower profits, processes uncertainties, and expensive manufacturing costs.

The segment for space applications accounted for the most significant portion of the market for radiation-hardened electronic components.

The space application market is predicted to grow at the fastest rate for radiation-hardened electronic components. Space applications segment made up the highest percentage of the market for rad-hard because of the increasing use of rad-hard parts for TV broadcasting, phone satellites, nanosatellites, and microsatellites. This is in addition to the growing market demand for satellites to observe the earth. Additionally, the growing number of space missions being conducted across the globe is predicted to fuel the development of the rad-hard market for space applications during the forecast time. The need from the commercial sector for durable and reliable electronic components that are rad-hard in satellites is anticipated to create opportunities for growth in this market over the near term. The aerospace and defense industry market is rated second in the forecast time. In addition market for implantable medical devices is expected to grow at the second-highest CAGR during the covid-19 epidemic.

Small satellites, as well as constellations, could be considered to be new opportunities for growth in COTS. COTS market. It is expected to have the highest share in the type of product market for radiation-hardened electronic devices over the forecast period.

The market for radiation-hardened electronics COTS is anticipated to capture a significant share and grow faster than the average rate over the forecast time. This is because they provide excellent resistance against high-energy charged particles and ionizing radiation. The commercially-off-the-shelf (COTS) MOSFETS market accounted for a significant portion of the worldwide radiation-hardened electronics market in 2019. India, Russia, and China are predicted to be the most promising growth market for rad-hard electronics as numerous mission space-related activities have been carried out in these regions in the last few years.

Asia Pacific is projected to expand at the fastest CAGR in the forecast timeframe.

North America accounted for most of the market for radiation-hardened electronic devices. This growth is due to the presence of top firms like Honeywell Aerospace & Defense (US), Microchip Technology (US) as well as Xilinx, Inc. (the US), and well-known space research institutes like The National Aeronautics and Space Administration (NASA) and The Florida Space Research Institute (FSRI) and the Keck Institute for Space Studies (KISS). Most of the components made of rad (nearly 50 percent) are provided from the US to various parts of the globe. Despite the slowing growth of the economy and the rising DoD budgetary expenses, the demand for electronics that have been tempered by radiation is expected to continue to be high due to the variety of satellite missions and military activities being carried out worldwide. However, Europe is likely to also offer lucrative opportunities for rad-hard component producers over the forecast time. Markets in APAC are anticipated to record the highest growth rate in the market for rad-hard components. With the latest manufacturing technology and the improving economic climates within China, India, and Japan, APAC will likely experience rapid growth over the next few years.

China is expected to expand at the fastest rate of CAGR the APAC Market for radiation-hardened electronic devices in the year 2019

Key Market Players

The Radiation-Hardened Electronics Market is controlled by a handful of globally established companies like Bae Systems (UK), Microchip Technology (US), STMicroelectronics (Switzerland), and Renesas Electronics (Japan), Honeywell Aerospace & Defense (US) as well as Infineon Technologies (Germany).

 

Radiation Hardened Electronics Market  Report Scope and Segmentation 
 
ATTRIBUTESDETAILS
ESTIMATED YEAR2022
BASE YEAR2021
FORECAST YEAR2030
HISTORICAL YEAR2017-2021
UNITValue (USD Million/Billion)
BY REGIONNorth America, Europe, Asia Pacific, Latin America, Middle East and Africa

Electronics with a high radiation-hardened Market by Component Type:

  • Digital and Analog Mixed Signal Devices
  • Memory
  • Controllers & Processors
  • Power Management Component

Radiation-Hardened Electronics Market by Manufacturing Technique:

  • Rad-Hard by Design
  • Rad-Hard Process by Process

Electronics with a high radiation-hardened Market By Type of Product:

  • Custom-made
  • Commercial-Off-The-Shelf (COTS)

The effects of radiation Electronics Market by Application:

  • Space
  • Aerospace & Defense
  • Nuclear Power Plants
  • Medical
  • Other

Regional Analysis

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • Italy
    • France
    • UK
    • Spain
    • Poland
    • Russia
    • The Netherlands
    • Norway
    • Czech Republic
    • Rest of Europe
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • Indonesia
    • Malaysia
    • Thailand
    • Singapore
    • Australia & New Zealand
    • Rest of Asia Pacific
  • South America
    • Brazil
    • Argentina
    • Colombia
    • Rest of South America
  • The Middle East & Africa
    • Saudi Arabia
    • UAE
    • South Africa
    • Northern Africa
    • Rest of MEA

Recent Changes:

  • In August of 2020, BAE Systems announced the expansion of the operations of its subsidiary in Austin, Texas, by creating a large campus at Parmer Austin Business Park. Work at the site will consist of new programs and existing business, which primarily includes designing, developing, and manufacturing radiofrequency and electro-optical/infrared countermeasure systems. The expanded capacity will allow the company to fulfill its customers’ commitments and position it to meet the need for essential products in the Electronic Systems business.
  • In June of 2019, Microchip Technology, via its Microsemi subsidiary, joined forces with STAR-Dundee to develop an experimental platform for evaluation that uses SpaceFibre technology. It was recently acknowledged by the VITA Standards Organization (VSO) as a control and data plane option for the SpaceVPX interconnect standard. The first to incorporate FPGAs that are not affected by radiation-induced changes to the configuration, The development board utilizes Microchip’s unique design for RTG4 devices to improve performance while also providing systems with a higher level of fail-safety within the space.
  • The month of April 2020 was when Infineon Technologies announced the acquisition of Cypress Semiconductor Corporation. The acquisition of Cypress will allow Infineon to focus its attention on growth engines for structural development and offer a more comprehensive array of applications. Cypress offers a different collection of microcontrollers, connection components, software ecosystems, and high-performance memory. The combination of Cypress’s powerful R&D capabilities, as well as its presence within Infineon’s markets in the US and Japan, increases Infineons international reach.
  • In December, STMicroelectronics announced the closing of the acquisition in full from Swedish Silicon carbide (SiC) wafer maker Nortel. This will help strengthen STs internal SiC ecosystem, control the increase in the yield and quality of wafers, and help support the long-term strategy for silicon carbide.
  • In May of 2019, Renesas Electronics Corporation announced the launch of a new radiation-hardened 16-channel driver, which includes an integrated 4-bit decoder that reduces the weight, size, and power (SWaP) for satellite commands and system for telemetry. The ISL72814SEH incorporates the decoder, the input level shifter, and 16 driver arrays for current within one single IC. This device allows satellite companies to dramatically increase the capacity of their systems and reduce footprint by 50 percent for their medium Earth orbit (MEO), geosynchronous earth orbit (GEO), and highly elliptical or orbit (HEO) deep space mission profiles.

Table of Contents

1 INTRODUCTION (Page No. – 30)
1.1 STUDY OBJECTIVES
1.2 MARKET DEFINITION
1.2.1 INCLUSIONS AND EXCLUSIONS
1.3 STUDY SCOPE
1.3.1 MARKETS COVERED
FIGURE 1 MARKET SEGMENTATION
1.3.2 GEOGRAPHIC SCOPE
1.3.3 YEARS CONSIDERED
1.4 CURRENCY
1.5 LIMITATIONS
1.6 STAKEHOLDERS
1.7 SUMMARY OF CHANGES

2 RESEARCH METHODOLOGY (Page No. – 35)
2.1 RESEARCH DATA
FIGURE 2 RADIATION-HARDENED ELECTRONICS MARKET: RESEARCH DESIGN
2.1.1 SECONDARY DATA
2.1.1.1 Major secondary sources
2.1.1.2 Key data from secondary sources
2.1.2 PRIMARY DATA
2.1.2.1 Key data from primary sources
2.1.2.2 Breakdown of primaries
2.1.3 SECONDARY AND PRIMARY RESEARCH
2.1.3.1 Key industry insights
2.2 MARKET SIZE ESTIMATION
2.2.1 BOTTOM-UP APPROACH
FIGURE 3 RADIATION-HARDENED ELECTRONICS: BOTTOM-UP APPROACH
2.2.2 TOP-DOWN APPROACH
FIGURE 4 RADIATION-HARDENED ELECTRONICS & SEMICONDUCTORS MARKET: TOP-DOWN APPROACH
2.3 MARKET BREAKDOWN AND DATA TRIANGULATION
FIGURE 5 DATA TRIANGULATION
2.4 RESEARCH ASSUMPTIONS

3 EXECUTIVE SUMMARY (Page No. – 44)
FIGURE 6 POWER MANAGEMENT SEGMENT, BY COMPONENT, TO HOLD LARGEST SHARE OF RADIATION-HARDENED ELECTRONICS MARKET DURING FORECAST PERIOD
FIGURE 7 RHBD SEGMENT, BY MANUFACTURING TECHNIQUE, TO LEAD RAD-HARD MARKET DURING FORECAST PERIOD
FIGURE 8 SPACE (SATELLITES) APPLICATION SEGMENT TO HOLD LARGEST SHARE AND REGISTER HIGHEST CAGR DURING FORECAST PERIOD
FIGURE 9 NORTH AMERICA HELD LARGEST SHARE OF RADIATION-HARDENED ELECTRONICS MARKET IN 2019

4 COVID-19 IMPACT ANALYSIS (Page No. – 48)
FIGURE 10 RADIATION-HARDENED ELECTRONICS MARKET, PRE- VS. POST-COVID-19 IMPACT
4.1 PRE-COVID-19 SCENARIO
4.2 POST-COVID-19 SCENARIO
4.3 APPLICATION IMPACT
4.4 REGIONAL IMPACT

5 PREMIUM INSIGHTS (Page No. – 50)
5.1 MARKET OPPORTUNITIES IN RADIATION-HARDENED ELECTRONICS MARKET
FIGURE 11 RADIATION-HARDENED ELECTRONICS MARKET TO EXHIBIT ATTRACTIVE GROWTH OPPORTUNITIES BETWEEN 2020 AND 2026
5.2 RADIATION-HARDENED ELECTRONICS MARKET ANALYSIS, BY COMPONENT
FIGURE 12 POWER MANAGEMENT SEGMENT TO HOLD LEADING POSITION BETWEEN 2020 AND 2026
5.3 RADIATION-HARDENED ELECTRONICS MARKET ANALYSIS, BY APPLICATION, 2020
FIGURE 13 SPACE APPLICATION SEGMENT TO CONTINUE TO LEAD RADIATION-HARDENED ELECTRONICS MARKET BETWEEN 2020 AND 2026
5.4 RADIATION-HARDENED ELECTRONICS MARKET ANALYSIS, BY MANUFACTURING TECHNIQUE, 2019
FIGURE 14 RADIATION HARDENING BY DESIGN SEGMENT HELD LARGEST MARKET SHARE IN 2019
5.5 RADIATION-HARDENED ELECTRONICS MARKET SHARE, BY REGION
FIGURE 15 US HELD THE LARGEST MARKET SHARE IN 2019

6 MARKET OVERVIEW (Page No. – 53)
6.1 INTRODUCTION
6.2 EVOLUTION: RADIATION-HARDENED ELECTRONICS MARKET
FIGURE 16 EVOLUTION OF RADIATION-HARDENED ELECTRONICS TECHNOLOGY
6.3 MARKET DYNAMICS
FIGURE 17 HIGH DEMAND IN COMMUNICATIONS SATELLITE SEGMENT TO PROPEL GROWTH OF RADIATION-HARDENED ELECTRONICS MARKET
6.3.1 DRIVERS
6.3.1.1 Increasing intelligence, surveillance, and reconnaissance (ISR) operations globally
6.3.1.2 Advancements in field-programming gate arrays (FPGAs) & multicore processor technologies for military and space applications
6.3.1.3 High demand for radiation-hardened electronics in the communication satellite segment
6.3.1.4 Increasing demand for electronic systems that can withstand significant radiation exposure in nuclear power industry
6.3.2 RESTRAINTS
6.3.2.1 Difficulties in creating an actual testing environment
6.3.2.2 High costs of development and designing
6.3.3 OPPORTUNITIES
6.3.3.1 Increasing research and development activities
6.3.3.2 Growing requirements for reconfigurable radiation-hardened components
6.3.3.3 Increasing use of commercial-off-the-shelf products in satellites and other space applications
6.3.4 CHALLENGES
6.3.4.1 Customized requirements of high-end consumers

7 INDUSTRY TRENDS (Page No. – 60)
7.1 INTRODUCTION
7.2 VALUE CHAIN ANALYSIS
FIGURE 18 VALUE CHAIN ANALYSIS: MAJOR VALUE IS ADDED DURING MATERIAL SELECTION, FABRICATION, &PACKAGING AND INTERFACING & SOFTWARE DEVELOPMENT STAGES, 2019
7.3 USE CASE ANALYSIS
7.3.1 RAD HARD BY DESIGN COMPONENTS ARE HIGHLY RELIABLE SOLUTIONS THAT CAN BE USED IN A WIDE VARIETY OF MISSIONS AND ENVIRONMENT
7.3.2 SPOT SHIELDING PREVENTS RADIATION FROM REACHING THE SEMICONDUCTOR
7.3.3 SINGLE BOARD COMPUTERS FOR SPACE ARE CURRENTLY DEPLOYED ON DOZENS OF SPACE MISSIONS
7.3.4 SKYWATER TECHNOLOGY IS ENHANCING CAPABILITIES OF MICROELECTRONICS AND UTILIZING APPROACHES DEVELOPED FOR STRATEGIC RADIATION-HARDENED SPECIFICATION
7.4 IMPACT OF USCHINA TRADE WAR
7.5 TECHNOLOGY TRENDS
FIGURE 19 EMERGING NEW SPACE MARKET AND COTS COMPONENTS: LEADING TRENDS AMONG KEY MARKET PLAYERS
7.6 AVERAGE SELLING PRICE TREND
TABLE 1 PRICING ANALYSIS
7.7 PATENTS ANALYSIS
7.8 TARIFF REGULATORY LANDSCAPE
7.9 RADIATION-HARDENED ELECTRONICS MARKET ECOSYSTEM
FIGURE 20 RADIATION-HARDENED ELECTRONICS MARKET ECOSYSTEM

8 RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT (Page No. – 68)
8.1 INTRODUCTION
FIGURE 21 POWER MANAGEMENT SEGMENT TO HOLD LARGEST SHARE OF RADIATION-HARDENED ELECTRONICS MARKET DURING FORECAST PERIOD
8.2 IMPACT OF COVID-19 ON RADIATION-HARDENED POWER MANAGEMENT COMPONENTS MARKET
TABLE 2 COVID-19 IMPACT ON RAD-HARD POWER MANAGEMENT COMPONENT MARKET, 20172026 (USD MILLION)
FIGURE 22 RADIATION-HARDENED POWER MANAGEMENT COMPONENTS ELECTRONICS MARKET, 20172026 (USD MILLION)
TABLE 3 RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 20172019 (USD MILLION)
TABLE 4 RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 20202026 (USD MILLION)
TABLE 5 RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 20172019 (THOUSAND UNIT)
TABLE 6 RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 20202026 (THOUSAND UNIT)
8.3 ANALOG AND DIGITAL MIXED SIGNAL DEVICES
TABLE 7 RADIATION-HARDENED ELECTRONICS MARKET, BY ANALOG AND DIGITAL MIXED SIGNAL DEVICES, 20172019 (USD MILLION)
TABLE 8 RADIATION-HARDENED ELECTRONICS MARKET, BY ANALOG AND DIGITAL MIXED SIGNAL DEVICES, 20202026 (USD MILLION)
TABLE 9 RADIATION-HARDENED ELECTRONICS MARKET, BY ANALOG AND DIGITAL MIXED SIGNAL DEVICES, 20172019 (THOUSAND UNIT)
TABLE 10 RADIATION-HARDENED ELECTRONICS MARKET, BY ANALOG AND DIGITAL MIXED SIGNAL DEVICES, 20202026 (THOUSAND UNIT)
TABLE 11 RADIATION-HARDENED ELECTRONICS MARKET, BY ANALOG AND DIGITAL MIXED SIGNAL DEVICES, BY MANUFACTURING TECHNIQUE, 20172019 (USD MILLION)
TABLE 12 RADIATION-HARDENED ELECTRONICS MARKET, BY ANALOG AND DIGITAL MIXED SIGNAL DEVICES, BY MANUFACTURING TECHNIQUE, 20202026 (USD MILLION)
TABLE 13 RADIATION-HARDENED ELECTRONICS MARKET, ANALOG & MIXED SIGNAL, BY PRODUCT TYPE, 20172019 (USD MILLION)
TABLE 14 RADIATION-HARDENED ELECTRONICS MARKET, ANALOG & MIXED SIGNAL, BY PRODUCT TYPE, 20202026 (USD MILLION)
8.3.1 RAD-HARD A/D AND D/A CONVERTERS
8.3.1.1 High usage in high-reliability applications
TABLE 15 RADIATION-HARDENED ELECTRONICS MARKET, A/D AND D/A, BY MANUFACTURING TECHNIQUE, 20172019 (USD MILLION)
TABLE 16 RADIATION-HARDENED ELECTRONICS MARKET, A/D AND D/A, BY MANUFACTURING TECHNIQUE, 20202026 (USD MILLION)
TABLE 17 RADIATION-HARDENED ELECTRONICS MARKET, A/D AND D/A, BY PRODUCT TYPE, 20172019 (USD MILLION)
TABLE 18 RADIATION-HARDENED ELECTRONICS, A/D AND D/A CONVERTERS, BY PRODUCT TYPE, 20202026 (USD MILLION)
8.3.2 MULTIPLEXERS & REGISTERS
8.3.2.1 Allow additional unpowered multiplexers to common data bus
TABLE 19 RADIATION-HARDENED ELECTRONICS MARKET, MULTIPLEXERS & REGISTERS, BY MANUFACTURING TECHNIQUE, 20172019 (USD MILLION)
TABLE 20 RADIATION-HARDENED ELECTRONICS MARKET, MULTIPLEXERS & REGISTERS, BY MANUFACTURING TECHNIQUE, 20202026 (USD MILLION)
TABLE 21 RADIATION-HARDENED ELECTRONICS, MULTIPLEXERS & REGISTERS, BY PRODUCT TYPE, 20172019 (USD MILLION)
TABLE 22 RADIATION-HARDENED ELECTRONICS MARKET, MULTIPLEXERS & REGISTERS, BY PRODUCT TYPE, 20202026 (USD MILLION)
8.4 PROCESSORS & CONTROLLERS
TABLE 23 RADIATION-HARDENED ELECTRONICS MARKET, BY PROCESSORS & CONTROLLERS COMPONENT, 20172019 (USD MILLION)
TABLE 24 RADIATION-HARDENED ELECTRONICS MARKET, BY PROCESSORS & CONTROLLERS COMPONENT, 20202026 (USD MILLION)
TABLE 25 RADIATION-HARDENED ELECTRONICS MARKET, BY PROCESSORS & CONTROLLERS COMPONENT, 20172019 (THOUSAND UNIT)
TABLE 26 RADIATION-HARDENED ELECTRONICS MARKET, BY PROCESSORS & CONTROLLERS COMPONENT, 20202026 (THOUSAND UNIT)
TABLE 27 RADIATION-HARDENED ELECTRONICS MARKET, BY PROCESSORS & CONTROLLERS COMPONENT, BY MANUFACTURING TECHNIQUE, 20172019 (USD MILLION)
TABLE 28 RADIATION-HARDENED ELECTRONICS MARKET, BY PROCESSORS & CONTROLLERS COMPONENT, BY MANUFACTURING TECHNIQUE, 20202026 (USD MILLION)
TABLE 29 RADIATION-HARDENED ELECTRONICS MARKET, PROCESSORS & CONTROLLERS, BY PRODUCT TYPE, 20172019 (USD MILLION)
TABLE 30 RADIATION-HARDENED ELECTRONICS MARKET, PROCESSORS & CONTROLLERS, BY PRODUCT TYPE, 20202026 (USD MILLION)
8.4.1 MPU
8.4.1.1 Growing adoption of MPU in space & defense applications
TABLE 31 RADIATION-HARDENED ELECTRONICS MARKET, MPU, BY MANUFACTURING TECHNIQUE, 20172019 (USD MILLION)
TABLE 32 RADIATION-HARDENED ELECTRONICS MARKET, MPU, BY MANUFACTURING TECHNIQUE, 20202026 (USD MILLION)
TABLE 33 RADIATION-HARDENED ELECTRONICS MARKET, MPU, BY PRODUCT TYPE, 20172019 (USD MILLION)
TABLE 34 RADIATION-HARDENED ELECTRONICS MARKET, MPU, BY PRODUCT TYPE, 20202026 (USD MILLION)
8.4.2 MCU
8.4.2.1 Extensively used in spacecraft subsystems
TABLE 35 RADIATION-HARDENED ELECTRONICS MARKET, MCU, BY MANUFACTURING TECHNIQUE, 20172019 (USD MILLION)
TABLE 36 RADIATION-HARDENED ELECTRONICS MARKET, MCU, BY MANUFACTURING TECHNIQUE, 20202026 (USD MILLION)
TABLE 37 RADIATION-HARDENED ELECTRONICS MARKET, MCU, BY PRODUCT TYPE, 20172019 (USD MILLION)
TABLE 38 RADIATION-HARDENED ELECTRONICS MARKET, MCU, BY PRODUCT TYPE, 20202026 (USD MILLION)
8.4.3 APPLICATION-SPECIFIC INTEGRATED CIRCUITS (ASICS)
8.4.3.1 Used for highly customized design requirement
TABLE 39 RADIATION-HARDENED ELECTRONICS MARKET, ASIC, BY MANUFACTURING TECHNIQUE, 20172019 (USD MILLION)
TABLE 40 RADIATION-HARDENED ELECTRONICS MARKET, ASIC, BY MANUFACTURING TECHNIQUE, 20202026 (USD MILLION)
TABLE 41 RADIATION-HARDENED ELECTRONICS MARKET, ASIC, BY PRODUCT TYPE, 20172019 (USD MILLION)
TABLE 42 RADIATION-HARDENED ELECTRONICS MARKET, ASIC, BY PRODUCT TYPE, 20202026 (USD MILLION)
8.4.4 FPGA
8.4.4.1 Helps in eliminating costs related to re-designing or manual updating
TABLE 43 RADIATION-HARDENED ELECTRONICS MARKET, FPGA, BY MANUFACTURING TECHNIQUE, 20172019 (USD MILLION)
TABLE 44 RADIATION-HARDENED ELECTRONICS MARKET, FPGA, BY MANUFACTURING TECHNIQUE, 20202026 (USD MILLION)
TABLE 45 RADIATION-HARDENED ELECTRONICS MARKET, FPGA, BY PRODUCT TYPE, 20172019 (USD MILLION)
TABLE 46 RADIATION-HARDENED ELECTRONICS MARKET, FPGA, BY PRODUCT TYPE, 20202026 (USD MILLION)
8.5 MEMORY
TABLE 47 RADIATION-HARDENED ELECTRONICS MARKET, BY MEMORY TYPE, 20172019 (USD MILLION)
TABLE 48 RADIATION-HARDENED ELECTRONICS MARKET, BY MEMORY TYPE, 20202026 (USD MILLION)
TABLE 49 RADIATION-HARDENED ELECTRONICS MARKET, BY MEMORY TYPE, 20172019 (THOUSAND UNIT)
TABLE 50 RADIATION-HARDENED ELECTRONICS MARKET, BY MEMORY TYPE, 20202026 (THOUSAND UNIT)
TABLE 51 RADIATION-HARDENED ELECTRONICS MARKET, BY MEMORY COMPONENT, 20172019 (USD MILLION)
TABLE 52 RADIATION-HARDENED ELECTRONICS MARKET, BY MEMORY COMPONENT, 20202026 (USD MILLION)
TABLE 53 RADIATION-HARDENED ELECTRONICS MARKET, MEMORY COMPONENT, BY MANUFACTURING TECHNIQUE, 20172019 (USD MILLION)
TABLE 54 RADIATION-HARDENED ELECTRONICS MARKET FOR MEMORY COMPONENT, BY MANUFACTURING TECHNIQUE, 20202026 (USD MILLION)
TABLE 55 RADIATION-HARDENED ELECTRONICS MARKET FOR MEMORY COMPONENT, BY PRODUCT TYPE, 20172019 (USD MILLION)
TABLE 56 RADIATION-HARDENED ELECTRONICS MARKET FOR MEMORY, BY PRODUCT TYPE, 20202026 (USD MILLION)
8.5.1 VOLATILE MEMORY
8.5.1.1 Dynamic Random-Access Memory (DRAM)
8.5.1.1.1 Most widely used rad-hard component
8.5.1.2 Static Random-Access Memory (SRAM)
8.5.1.2.1 High adoption in embedded electronics
TABLE 57 RADIATION-HARDENED ELECTRONICS MARKET, VOLATILE MEMORY, BY MANUFACTURING TECHNIQUE, 20172019 (USD MILLION)
TABLE 58 RADIATION-HARDENED ELECTRONICS MARKET, VOLATILE MEMORY, BY MANUFACTURING TECHNIQUE, 20202026 (USD MILLION)
TABLE 59 RADIATION-HARDENED ELECTRONICS MARKET, VOLATILE MEMORY, BY PRODUCT TYPE, 20172019 (USD MILLION)
TABLE 60 RADIATION-HARDENED ELECTRONICS MARKET, VOLATILE MEMORY, BY PRODUCT TYPE, 20202026 (USD MILLION)
8.5.2 NON-VOLATILE MEMORIES
8.5.2.1 MRAM
8.5.2.1.1 Alternative NVM technologies accelerated adoption of MRAM
8.5.2.2 FLASH
8.5.2.2.1 NAND flash memory used for extreme radiation protection
8.5.2.3 Others (ReRAM, EEPROM, NVRAM)
TABLE 61 RADIATION-HARDENED ELECTRONICS MARKET, NON-VOLATILE MEMORY, BY MANUFACTURING TECHNIQUE, 20172019 (USD MILLION)
TABLE 62 RADIATION-HARDENED ELECTRONICS MARKET, NON-VOLATILE MEMORY, BY MANUFACTURING TECHNIQUE, 20202026 (USD MILLION)
TABLE 63 RADIATION-HARDENED ELECTRONICS, NON- VOLATILE MEMORY, BY PRODUCT TYPE, 20172019 (USD MILLION)
TABLE 64 RADIATION-HARDENED ELECTRONICS MARKET, NON-VOLATILE MEMORY, BY PRODUCT TYPE, 20202026 (USD MILLION)
8.6 POWER MANAGEMENT
TABLE 65 RADIATION-HARDENED ELECTRONICS MARKET, BY POWER MANAGEMENT COMPONENT, 20172019 (USD MILLION)
TABLE 66 RADIATION-HARDENED ELECTRONICS MARKET, BY POWER MANAGEMENT COMPONENT, 20202026 (USD MILLION)
TABLE 67 RADIATION-HARDENED ELECTRONICS MARKET, BY POWER MANAGEMENT COMPONENT, 20172019 (THOUSAND UNIT)
TABLE 68 RADIATION-HARDENED ELECTRONICS MARKET, BY POWER MANAGEMENT COMPONENT, 20202026 (THOUSAND UNIT)
TABLE 69 RADIATION-HARDENED ELECTRONICS MARKET, BY POWER MANAGEMENT COMPONENT, BY MANUFACTURING TECHNIQUE, 20172019 (USD MILLION)
TABLE 70 RADIATION-HARDENED ELECTRONICS MARKET, BY POWER MANAGEMENT COMPONENT, BY MANUFACTURING TECHNIQUE, 20202026 (USD MILLION)
8.6.1 MOSFET
8.6.1.1 Most widely used rad-hard component for outer space requirements
TABLE 71 RADIATION-HARDENED ELECTRONICS MARKET, MOSFET, BY MANUFACTURING TECHNIQUE, 20172019 (USD MILLION)
TABLE 72 RADIATION-HARDENED ELECTRONICS MARKET, MOSFET, BY MANUFACTURING TECHNIQUE, 20202026 (USD MILLION)
TABLE 73 RADIATION-HARDENED ELECTRONICS MARKET, MOSFET, BY PRODUCT TYPE, 20172019 (USD MILLION)
TABLE 74 RADIATION-HARDENED ELECTRONICS MARKET, MOSFET, BY PRODUCT TYPE, 20202026 (USD MILLION)
8.6.2 DIODE
8.6.2.1 Oxynitride-protective entrance window adds advantage over traditional silicon photodiodes
TABLE 75 RADIATION-HARDENED ELECTRONICS MARKET, DIODE, BY MANUFACTURING TECHNIQUE, 20172019 (USD MILLION)
TABLE 76 RADIATION-HARDENED ELECTRONICS MARKET, DIODE, BY MANUFACTURING TECHNIQUE, 20202026 (USD MILLION)
TABLE 77 RADIATION-HARDENED ELECTRONICS MARKET, DIODES, BY PRODUCT TYPE, 20172019 (USD MILLION)
TABLE 78 RADIATION-HARDENED ELECTRONICS MARKET, DIODES, BY PRODUCT TYPE, 20202026 (USD MILLION)
8.6.3 THYRISTOR
8.6.3.1 Widely used for aerospace & defense and nuclear applications
TABLE 79 RADIATION-HARDENED ELECTRONICS MARKET, THYRISTOR, BY MANUFACTURING TECHNIQUE, 20172019 (USD MILLION)
TABLE 80 RADIATION-HARDENED ELECTRONICS MARKET, THYRISTOR, BY MANUFACTURING TECHNIQUE, 20202026 (USD MILLION)

Major Segmentation

Electronics with a high radiation-hardened Market by Component Type:

  • Digital and Analog Mixed Signal Devices
  • Memory
  • Controllers & Processors
  • Power Management Component

Radiation-Hardened Electronics Market by Manufacturing Technique:

  • Rad-Hard by Design
  • Rad-Hard Process by Process

Electronics with a high radiation-hardened Market By Type of Product:

  • Custom-made
  • Commercial-Off-The-Shelf (COTS)

The effects of radiation Electronics Market by Application:

  • Space
  • Aerospace & Defense
  • Nuclear Power Plants
  • Medical
  • Other

Major Companies

The Radiation-Hardened Electronics Market is controlled by a handful of globally established companies like Bae Systems (UK), Microchip Technology (US), STMicroelectronics (Switzerland), and Renesas Electronics (Japan), Honeywell Aerospace & Defense (US) as well as Infineon Technologies (Germany).

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