Description of the Report
The Radiation Hardened Electronics Market is projected to increase by a factor of 1.4 billion $ 1.4 billion by 2020 and reach approximately USD 1.7 billion by 2026 at an average CAGR of 3.5 percent during the forecast time.
Industries utilize radiation-hardened electronics to shield systems and devices from radiation-induced damage. The increasing demand for intelligence, surveillance, and reconnaissance (ISR) operations, the high demand for rad-hard electronics in satellite communications, and the growing need for electronic systems capable of enduring significant radioactivity in the nuclear power sector have contributed to the rapid growth of the market. However, challenges in developing natural testing environments and the expensive development costs and design could limit the growth.
COVID-19 Impact on the Radiation Hardened Electronics Market
The COVID-19 crisis has caused worldwide health issues and economic crises. Demand for radiation-hardened electronic devices was growing steadily before the COVID-19 timeframe. Due to the tensions between China and America and the immediate effect of COVID-19 could be seen in the imports of radiation-hardened electronic components within the US. The US, along with Europe, are the leading suppliers of semiconductor parts. The high import tariffs for radiation-hardened electronic components from these countries and disruptions to the supply chain of their components are adversely impacting manufacturers of electronics with a hardened radiation source within both the US and Europe. This could lead to an imbalance in demand and supply, which could harm the expansion of the industry. But, the market is predicted to recover slowly in the coming 2 years and is projected to expand at a CAGR of 3.5 percent from 2020 until 2026.
Drivers: Increasing intelligence surveillance and recon (ISR) global operations
Intelligence, surveillance, and recon (ISR) actions are growing daily within the field of defense to stay in front of adversaries and allies. Every ISR operation will succeed if high-quality, durable, and eco-friendly end-products are utilized. Therefore, the most recent processors, controllers, and electronic equipment are ideal for maritime, space, and military applications in ISR operations. For space operations, electronic equipment has to withstand extreme environments for about 15 years without any loss in performance or power. Electronic components that are radiation-hardened can meet the demands of ISR operations, both in military and commercial applications.
Limitations: Costs of designing and developing
There are some questions about the high cost of radiation-hardened electronics. Because of their lower sales and production volumes and lengthy development cycles have remained expensive all through, which has slowed the competition between major players in the world market for radiation-hardened electronic components. Due to these causes affecting the market, there have been very few innovations created in the last few years, particularly in the field of power devices. Therefore, this could soon slow the market for radiation-hardened electronic devices.
Opportunity: Increasing use of commercial-off-the-shelf products in satellites and other space applications
The importance of commercial off-the-shelf (COTS) components in space satellites and other applications is crucial since the demand for cheap nanosatellites is increasing. COTS parts can be utilized to build small satellites which are mission-specific. For instance, example, the US military has launched plans for smaller satellites to reduce the cost of launch, and the time it takes between deciding to launch a satellite to accomplish a specific mission and finally getting that satellite placed in orbit. COTS parts are also attractive because they provide the highest bandwidth and performance. Demand for high bandwidth in satellite applications has forced designers to select radiation-hardened electronic components.
The challenge: Customized needs of premium customers
The main challenge facing the producers of radiation-hardened electronics and semiconductor systems is the particular requirements of the high-end consumer. This is mainly due to the fact that the military and space missions are highly confidential and application-oriented, due to which there is a vast difference between the requirements of one consumer from another. The businesses strive to meet these requirements as much time, money, and R&D are required during development. Companies also need to modify their design method to meet each requirement of the final customer, for example, the design of radiation hardening and the method. This results in lengthy time-to-market cycles for components that are radiation hardened.
Power Management, by component type, held the most significant part of the Radiation-Hardened Electronics Market.
The power management market has been one of the major segments for radiation-hardened electronic components. The growing power management sector is caused by the rising demand for MOSFETs and diodes for top-of-the-line applications for the defense and space industries. The power management components, such as power switches and metal-oxide-semiconductor field-effect transistors (MOSFETs), accounted for a significant share of ~40% of the global radiation-hardened electronics market in 2019. Power MOSFETs are utilized for high-reliability applications and are specially designed for requirements in space. They have a high degree of durability, Ionizing radiation, and high-energy charged particles. Due to the current COVID-19 disease that is affecting the power management segment has been somewhat affected. Still, it is expected to expand faster over the forecast time alongside other components.
RHBD, by the manufacturing technique type will expand at a faster rate during the forecast time
Radiation hardening by design (RHBD) manufacturing method is predicted to expand at the fastest rate in the electronics market that is radiation-hardened due to the low price per chip, high volume production, and ease of modification. The RHBD microcontrollers, memories, and ASICs are primarily utilized in the space and defense industries and the nuclear power industry. The demand for RHBD designs will be boosted during COVID-19 since RHBD permits easy modification through various government programs based on their intended applications. Although radiation hardening through the procedure (RHBP) is a viable process for producing electronic systems that are radiation-hardened, its acceptance rate for microelectronics producers is lower mainly due to the lower profits, processes uncertainties, and expensive manufacturing costs.
The segment for space applications accounted for the most significant portion of the market for radiation-hardened electronic components.
The space application market is predicted to grow at the fastest rate for radiation-hardened electronic components. Space applications segment made up the highest percentage of the market for rad-hard because of the increasing use of rad-hard parts for TV broadcasting, phone satellites, nanosatellites, and microsatellites. This is in addition to the growing market demand for satellites to observe the earth. Additionally, the growing number of space missions being conducted across the globe is predicted to fuel the development of the rad-hard market for space applications during the forecast time. The need from the commercial sector for durable and reliable electronic components that are rad-hard in satellites is anticipated to create opportunities for growth in this market over the near term. The aerospace and defense industry market is rated second in the forecast time. In addition market for implantable medical devices is expected to grow at the second-highest CAGR during the covid-19 epidemic.
Small satellites, as well as constellations, could be considered to be new opportunities for growth in COTS. COTS market. It is expected to have the highest share in the type of product market for radiation-hardened electronic devices over the forecast period.
The market for radiation-hardened electronics COTS is anticipated to capture a significant share and grow faster than the average rate over the forecast time. This is because they provide excellent resistance against high-energy charged particles and ionizing radiation. The commercially-off-the-shelf (COTS) MOSFETS market accounted for a significant portion of the worldwide radiation-hardened electronics market in 2019. India, Russia, and China are predicted to be the most promising growth market for rad-hard electronics as numerous mission space-related activities have been carried out in these regions in the last few years.
Asia Pacific is projected to expand at the fastest CAGR in the forecast timeframe.
North America accounted for most of the market for radiation-hardened electronic devices. This growth is due to the presence of top firms like Honeywell Aerospace & Defense (US), Microchip Technology (US) as well as Xilinx, Inc. (the US), and well-known space research institutes like The National Aeronautics and Space Administration (NASA) and The Florida Space Research Institute (FSRI) and the Keck Institute for Space Studies (KISS). Most of the components made of rad (nearly 50 percent) are provided from the US to various parts of the globe. Despite the slowing growth of the economy and the rising DoD budgetary expenses, the demand for electronics that have been tempered by radiation is expected to continue to be high due to the variety of satellite missions and military activities being carried out worldwide. However, Europe is likely to also offer lucrative opportunities for rad-hard component producers over the forecast time. Markets in APAC are anticipated to record the highest growth rate in the market for rad-hard components. With the latest manufacturing technology and the improving economic climates within China, India, and Japan, APAC will likely experience rapid growth over the next few years.
China is expected to expand at the fastest rate of CAGR the APAC Market for radiation-hardened electronic devices in the year 2019
Key Market Players
The Radiation-Hardened Electronics Market is controlled by a handful of globally established companies like Bae Systems (UK), Microchip Technology (US), STMicroelectronics (Switzerland), and Renesas Electronics (Japan), Honeywell Aerospace & Defense (US) as well as Infineon Technologies (Germany).
|Radiation Hardened Electronics Market Report Scope and Segmentation|
|UNIT||Value (USD Million/Billion)|
|BY REGION||North America, Europe, Asia Pacific, Latin America, Middle East and Africa|
Electronics with a high radiation-hardened Market by Component Type:
- Digital and Analog Mixed Signal Devices
- Controllers & Processors
- Power Management Component
Radiation-Hardened Electronics Market by Manufacturing Technique:
- Rad-Hard by Design
- Rad-Hard Process by Process
Electronics with a high radiation-hardened Market By Type of Product:
- Commercial-Off-The-Shelf (COTS)
The effects of radiation Electronics Market by Application:
- Aerospace & Defense
- Nuclear Power Plants
- North America
- The Netherlands
- Czech Republic
- Rest of Europe
- Asia Pacific
- South Korea
- Australia & New Zealand
- Rest of Asia Pacific
- South America
- Rest of South America
- The Middle East & Africa
- Saudi Arabia
- South Africa
- Northern Africa
- Rest of MEA
- In August of 2020, BAE Systems announced the expansion of the operations of its subsidiary in Austin, Texas, by creating a large campus at Parmer Austin Business Park. Work at the site will consist of new programs and existing business, which primarily includes designing, developing, and manufacturing radiofrequency and electro-optical/infrared countermeasure systems. The expanded capacity will allow the company to fulfill its customers’ commitments and position it to meet the need for essential products in the Electronic Systems business.
- In June of 2019, Microchip Technology, via its Microsemi subsidiary, joined forces with STAR-Dundee to develop an experimental platform for evaluation that uses SpaceFibre technology. It was recently acknowledged by the VITA Standards Organization (VSO) as a control and data plane option for the SpaceVPX interconnect standard. The first to incorporate FPGAs that are not affected by radiation-induced changes to the configuration, The development board utilizes Microchip’s unique design for RTG4 devices to improve performance while also providing systems with a higher level of fail-safety within the space.
- The month of April 2020 was when Infineon Technologies announced the acquisition of Cypress Semiconductor Corporation. The acquisition of Cypress will allow Infineon to focus its attention on growth engines for structural development and offer a more comprehensive array of applications. Cypress offers a different collection of microcontrollers, connection components, software ecosystems, and high-performance memory. The combination of Cypress’s powerful R&D capabilities, as well as its presence within Infineon’s markets in the US and Japan, increases Infineons international reach.
- In December, STMicroelectronics announced the closing of the acquisition in full from Swedish Silicon carbide (SiC) wafer maker Nortel. This will help strengthen STs internal SiC ecosystem, control the increase in the yield and quality of wafers, and help support the long-term strategy for silicon carbide.
- In May of 2019, Renesas Electronics Corporation announced the launch of a new radiation-hardened 16-channel driver, which includes an integrated 4-bit decoder that reduces the weight, size, and power (SWaP) for satellite commands and system for telemetry. The ISL72814SEH incorporates the decoder, the input level shifter, and 16 driver arrays for current within one single IC. This device allows satellite companies to dramatically increase the capacity of their systems and reduce footprint by 50 percent for their medium Earth orbit (MEO), geosynchronous earth orbit (GEO), and highly elliptical or orbit (HEO) deep space mission profiles.