Market Overview

The global embedded die packaging technology market is expected to witness significant growth in the coming years. This can be attributed to the increasing demand for miniaturization of electronic devices, as well as the growing need for higher performance and functionality.

Embedded die packaging technology is a technique used in microelectronics that involves embedding die within a substrate. This technology allows for a reduction in the size of electronic devices while improving their performance and functionality.

The embedded die packaging technology market is expected to grow at a CAGR of over 15% during the forecast period (2021-2026). The market is expected to reach USD 34.8 billion by 2026, up from USD 15.9 billion in 2020.

Meaning

Embedded die packaging technology involves embedding die within a substrate, which can be a printed circuit board (PCB), a flexible circuit, or a system-in-package (SIP). This technique is used to miniaturize electronic devices and improve their performance.

The die can be embedded using various methods, such as flip-chip bonding, wire bonding, or through-silicon vias (TSVs). The choice of method depends on the requirements of the application and the type of substrate being used.

Executive Summary

The embedded die packaging technology market is expected to witness significant growth in the coming years, driven by the increasing demand for miniaturization of electronic devices and the need for higher performance and functionality.

The market is expected to grow at a CAGR of over 15% during the forecast period (2021-2026) and reach USD 34.8 billion by 2026.

Important Note: The companies listed in the image above are for reference only. The final study will cover 18–20 key players in this market, and the list can be adjusted based on our client’s requirements.

Key Market Insights

• The embedded die packaging technology market is driven by the increasing demand for miniaturization of electronic devices and the need for higher performance and functionality.
• The Asia-Pacific region is expected to dominate the market, driven by the presence of major semiconductor manufacturers in the region.
• The automotive and consumer electronics industries are expected to be the major end-users of embedded die packaging technology.
• The flip-chip bonding method is expected to be the most widely used method for embedding die.

Market Drivers

1. Increasing demand for miniaturization of electronic devices: The trend towards miniaturization of electronic devices is driving the demand for embedded die packaging technology. This technology allows for the reduction in the size of electronic devices while improving their performance and functionality.
2. Need for higher performance and functionality: The need for higher performance and functionality in electronic devices is also driving the demand for embedded die packaging technology. This technology allows for the integration of multiple functions and components within a single package, thereby improving the performance of the device.
3. Advancements in semiconductor technology: The advancements in semiconductor technology, such as the development of TSVs and the increasing use of flip-chip bonding, are also driving the demand for embedded die packaging technology.

Market Restraints

1. High cost of embedded die packaging technology: The high cost of embedded die packaging technology is a major restraint for the market. This technology requires specialized equipment and materials, which increases the cost of production.
2. Lack of standardization: The lack of standardization in embedded die packaging technology is also a major restraint for the market. This makes it difficult for manufacturers to adopt the technology, as they need to invest in developing their own processes and standards.

Market Opportunities

1. Increasing adoption of IoT and AI: The increasing adoption of IoT and AI is creating opportunities for the embedded die packaging technology market. These technologies require high-performance and compact electronic devices, which can be achieved using embedded die packaging technology.
2. Growing demand for electric and hybrid vehicles: The growing demand for electric and hybrid vehicles is also creating opportunities for the embedded die packaging technology market. These vehicles require high-performance and reliable electronics, which can be achieved using embedded die packaging technology.

Market Dynamics

The embedded die packaging technology market is highly dynamic, driven by a range of factors such as technological advancements, changing consumer preferences, and market trends.

The market is characterized by intense competition, with major players such as ASE Group, Amkor Technology, and TDK Corporation dominating the market. The market is also marked by the presence of several small and medium-sized players, which are focused on providing specialized services and solutions.

Regional Analysis

The Asia-Pacific region is expected to dominate the embedded die packaging technology market, driven by the presence of major semiconductor manufacturers in the region. The region is also expected to witness significant growth in the coming years, driven by the increasing adoption of IoT and AI and the growing demand for electric and hybrid vehicles.

The North American and European regions are also expected to witness significant growth in the coming years, driven by the increasing demand for high-performance and reliable electronics.

Competitive Landscape

Leading Companies in the Embedded Die Packaging Technology Market:

1. ASE Technology Holding Co., Ltd.
2. Amkor Technology, Inc.
3. TDK Corporation
4. Stats ChipPAC Pte. Ltd. (JCET Group)
5. Samsung Electro-Mechanics Co., Ltd.
6. AT&S Austria Technologie & Systemtechnik AG
7. Shinko Electric Industries Co., Ltd.
8. Fujikura Ltd.
9. Nepes Corporation
10. Siliconware Precision Industries Co., Ltd. (SPIL)

Please note: This is a preliminary list; the final study will feature 18–20 leading companies in this market. The selection of companies in the final report can be customized based on our client’s specific requirements.

Segmentation

The embedded die packaging technology market can be segmented based on the type of substrate, the method of embedding die, and the end-user industry.

By substrate type, the market can be segmented into printed circuit board (PCB), flexible circuit, and system-in-package (SIP).

By method of embedding die, the market can be segmented into flip-chip bonding, wire bonding, and through-silicon vias (TSVs).

By end-user industry, the market can be segmented into automotive, consumer electronics, industrial, healthcare, and others.

Category-wise Insights

1. Printed circuit board (PCB): The PCB segment is expected to dominate the market, driven by the increasing demand for compact and high-performance electronic devices.
2. Flip-chip bonding: The flip-chip bonding method is expected to be the most widely used method for embedding die, driven by its high reliability and low cost.
3. Automotive: The automotive industry is expected to be the major end-user of embedded die packaging technology, driven by the growing demand for electric and hybrid vehicles.

Key Benefits for Industry Participants and Stakeholders

1. Improved performance and functionality of electronic devices.
2. Reduction in the size of electronic devices.
3. Integration of multiple functions and components within a single package.
4. Enhanced reliability and durability of electronic devices.

SWOT Analysis

Strengths:

1. Ability to reduce the size of electronic devices.
2. Improved performance and functionality of electronic devices.
3. Integration of multiple functions and components within a single package.

Weaknesses:

1. High cost of production.
2. Lack of standardization.

Opportunities:

1. Increasing adoption of IoT and AI.
2. Growing demand for electric and hybrid vehicles.

Threats:

1. Intense competition from major players.
2. Changing consumer preferences.

Market Key Trends

1. Increasing adoption of TSVs.
2. Growing demand for flexible and stretchable electronics.
3. Integration of sensors and other components within electronic devices.

Covid-19 Impact

The Covid-19 pandemic has had a significant impact on the embedded die packaging technology market, with the market witnessing a slowdown in growth in 2020 due to disruptions in the supply chain and reduced demand for electronic devices.

However, the market is expected to recover in the coming years, driven by the increasing adoption of IoT and AI and the growing demand for high-performance and reliable electronics.

The pandemic has also highlighted the importance of embedded die packaging technology in various industries such as healthcare, where there is a growing demand for compact and reliable medical devices.

Key Industry Developments

1. In February 2021, Amkor Technology announced the expansion of its embedded die packaging technology portfolio with the launch of the Chiplet Integration with Bonding on Leadframe (CIBL) technology.
2. In September 2020, TDK Corporation announced the development of a new technology for embedding magnetic sheets in PCBs, which is expected to improve the performance of electronic devices.
3. In August 2020, ASE Group announced the development of a new technology for embedding die in PCBs, which is expected to reduce the size of electronic devices and improve their performance.

Analyst Suggestions

1. The market is expected to witness significant growth in the coming years, driven by the increasing demand for miniaturization of electronic devices and the need for higher performance and functionality.
2. The Asia-Pacific region is expected to dominate the market, driven by the presence of major semiconductor manufacturers in the region.
3. The automotive and consumer electronics industries are expected to be the major end-users of embedded die packaging technology.

Future Outlook

The embedded die packaging technology market is expected to witness significant growth in the coming years, driven by the increasing demand for miniaturization of electronic devices and the need for higher performance and functionality.

The market is expected to witness a shift towards the use of TSVs and other advanced methods for embedding die, as well as the integration of sensors and other components within electronic devices.

Conclusion

The embedded die packaging technology market is poised for significant growth in the coming years, driven by the increasing demand for miniaturization of electronic devices and the need for higher performance and functionality.

The market is highly competitive, with major players such as ASE Group, Amkor Technology, and TDK Corporation dominating the market. The market is also marked by the presence of several small and medium-sized players, which are focused on providing specialized services and solutions.

Overall, the embedded die packaging technology market is expected to witness significant growth in the coming years, driven by technological advancements and changing consumer preferences.